Solder Paste SN63Pb37
A classic mid-temperature Tin lead solder paste. Its working temperature falls into the preheat temperature from 90℃ to 150℃ with a melting point of 183℃.. This product is suitable for the highly demanding reflow-soldering process.
Applications
The Sn63Pb37 mid-temperature leaded solder paste is applicable for the LED circuit boards, diversified lighting fixtures, computer motherboards, phone motherboards, printed circuit boards, surface mount devices, as well as all kinds of high-precision circuit boards.
Technical Data Sheet
Specification
| Specification | Sn63Pb37 |
| Appearance | Adhesive paste in grayish black |
| Weight | 500g Tub |
| Melting Point, ℃ | 183 |
| Spec. Gravity, g/cm3 | 8.60 |
| Tensile Strength, MPa | 51.3 |
Chemical Components
| Type | Chemical Composition (wt. %) | ||||||||
| Sn | Pb | Sb | Cu | Bi | Zn | Fe | Al | Cd | |
| Sn63Pb37 | 63±0.5 | Residue Content | < 0.2 | < 0.08 | < 0.1 | < 0.001 | < 0.02 | < 0.001 | < 0.002 |
Preservation Method
The Sn63Pb37 mid temperature tin lead solder paste for PCB had better be stored at a temperature range from zero to 10℃. The service life of the unsealed product is 6 months. Furthermore, our product can not be exposed to sunshine.
